Background

Cooling of semiconductor hot-spots has developed into a demanding task. In recent years, following the prediction of Moore's law, the high power density of microchips has increased rapidly, thereby increasing temperature and temperature non-uniformity on die and across chips. The drive for extremely low thermal resistance is further accelerated by the trend towards smaller system enclosures, which provide an increase in the surrounding air temperature and thereby makes the cooling task even more difficult.

Current commercially available cooling technologies are at the very limit, therefore struggling to keep up with the electronic performance curve. This means that the cooling systems of today are getting noisier, bulkier or both.

For most applications, today's challenge is to create cooling devices that are reliable, efficient, compact and low-noise (if not silent). Danamics does all of those.