Background

Cooling of semiconductor hot-spots has developed into a demanding task. In recent years the high power density of microchips has increased rapidly, thereby increasing temperature and temperature non -uniformity on die and across chips. The drive for extremely low thermal resistance if further accelerated by the trend towards smaller system enclosures which has made the cooling task even more difficult.

This gives the cooling companies a new challenge. To create cooling devices that is reliable, efficient and compact. Danamics does all of those.